설명
DUTIES: Lead the management of the overall die program management process at a die line level. Ensure engineering packages adhere to best practices, manage, and monitor timing through the construction and verification phase as well as facilitate and manage the transition to the secondary tryout and production facility. Ensure SPQRC metrics are attained for a die line and that lessons learned are compiled and driven into future programs. Ensure compliance with company policies and procedures. Attend Buyoff for Die Design meeting. Analyze the stamping process, suggest improvements, and apply Lessons Learned. Attend Final Die Design Review. Attend Buyoff for Die Construction meeting. Analyze the Die Machining File released for 3D machining. Develop Bearing Zone file. Apply die adjustment according to Lessons Learned from past programs. Coordinate Formability Package Validation meeting. Host First Panel Review meeting and release Priority 1 Sheet. Ensure Die Layout for part improving quality looping is according to Priority 1 Sheet. Coordinate corrective action plans for die related issues. Ensure Open Issues are complete and closed on time. Perform Jewel Radius and Zebra Analyses Processes. Perform Part Dimensional and Surfacing information for PAR meeting. Get Parts PAR White after just one quality looping per Panel. Validate event deliverable list / ITP documentation (Die Static and Dynamic reviews, and SOP 50). Support die surface treatment plans. Participate, and support T-Events. Support and attend GSQE/Painted Panel Review events. Verify Submittal of QAB's for all die and equipment related issues. Support EWOs and Die implementation. Hybrid Work Policy - 3 days In-office, 2 days remote - Must be able to report to local office.
REQUIREMENTS: Bachelor's degree in Metallurgical Engineering, Mechanical Engineering, Material Engineering, or related field of study and 5 years of experience as a Tool and Die Integration Engineer, CAD Engineer, or related role. Five years of experience with: Project Management methodologies including cost, timing, scope, quality, people management, integration, communication, risk management, procurement, and stakeholders management; GDVP, Product Engineer Release Levels, Die Operation Lineup (DOL), Die Machining File (DMF), Formability Analysis, V-Events, and T-Events; Commercial software packages including NX 11.0.2.7 (ASMS 1592), Teamcenter 11 (ASMS 1168), MS Office, Teamcenter Visualization Mockup 11.2 (ASMS 6212), GOM, AutoForm, and PamStamp); and Die Engineering Process, Formability, Die Design, Transfer and Conventional Press Lines Configuration, Patterns, Foundry, Machining, Die Construction Practices, and Try-out and T-Events.
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