Senior Hardware Engineer: Connectivity Modules

Descripción

Work Arrangement:

Hybrid : 

This role is categorized as hybrid. The selected candidate is expected to report to Warren, MI or Sunnyvale, CA at least three days per week (Tuesday–Thursday).

Our Mission:

At General Motors, our product teams are redefining mobility. Through a human-centered design process, we create vehicles and experiences that are designed not just to be seen, but to be felt. We’re turning today’s impossible into tomorrow’s standard —from breakthrough hardware and battery systems to intuitive design, intelligent software, and next-generation safety and entertainment features. 

Every day, our products move millions of people as we aim to make driving safer, smarter, and more connected, shaping the future of transportation on a global scale.

The Ideal Candidate:

Connectivity is a critical enabler of advanced vehicle functionality, including safety, user experience, and cloud-connected services. We are seeking a Senior Hardware Engineer to lead the design and system integration of next-generation automotive connectivity platforms across GM vehicle architectures.

• The ideal candidate has strong experience in hardware architecture, system bring-up, and cross-functional integration of complex embedded systems combining high-performance compute and wireless connectivity.

• They are comfortable operating across hardware, firmware, and RF domains to drive system-level decisions and resolve complex issues.

The Role: 

• The Senior Hardware Engineer will lead the design, architecture, and system integration of connectivity modules across GM vehicle platforms. This includes defining system architecture, driving schematic and PCB design execution, leading board bring-up, and ensuring robust system performance across all operating conditions.

• This role requires end-to-end ownership, from concept through production, with strong collaboration across silicon vendors, RF, firmware, mechanical and thermal.

What You’ll do:

• Own end-to-end hardware design and bring-up of connectivity modules from concept through production.

• Define system architecture, including SoC selection, memory (LPDDR), power architecture, and high-speed interfaces (PCIe, USB, Ethernet).

• Drive schematic design reviews and guide PCB layout, ensuring strong SI/PI, RF coexistence, and manufacturability.

• Lead board bring-up, including power sequencing, clocking, reset, and boot initialization.

• Drive system-level integration across hardware, firmware, RF, and mechanical domains.

• Perform root-cause analysis of complex, cross-domain issues, including interactions between silicon, board design, RF, and software.

• Make system-level tradeoffs across performance, power, cost, thermals, and reliability.

• Validate high-speed interfaces including LPDDR5, PCIe, USB, Ethernet, SPI/I2C, CAN, and LIN.

• Debug multi-domain issues such as RF desense, power noise coupling, and signal integrity degradation.

• Collaborate with silicon vendors (e.g., Qualcomm, NXP, TI) on SoC bring-up and interface behavior.

• Collaborate with firmware and software teams to enable platform functionality and debug system issues.

• Define validation strategy and coverage, ensuring system-level robustness across corner cases and operating conditions.

• Leverage lab instrumentation (oscilloscopes, VNAs, spectrum analyzers, logic analyzers) to characterize and debug system performance.

Your Skills & Abilities (Required Qualifications):

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science or related field.

• 5+ years of experience in hardware development, including board design, system bring-up, and debugging.

• Strong experience designing and integrating complex embedded hardware systems.

• Experience with SoC-based systems, including power architecture, clocks, resets, and boot flows.

• Experience with high-speed digital design (PCIe, USB, Ethernet, LPDDR) including signal and power integrity considerations.

• Proven ability to debug system-level issues across hardware, firmware, and RF domains.

• Experience with power delivery design, PMICs, Voltage regulators, low-power design principles, and deep sleep/wake-up flows.

• Strong problem-solving skills with ability to navigate complex, ambiguous system issues.

• Ability to independently drive technical decisions and influence cross-functional teams.

What Will Give You a Competitive Edge (Preferred Qualifications):

• Master’s degree in related engineering field.

• 8+ years of experience in hardware development, including board design, system bring-up, and debugging.

• Knowledge and experience in wireless interfaces and technology.

• Experience with automotive hardware development (EMI/EMC, environmental, reliability).

• Experience supporting products through production ramp and field issue resolution.

Benefits:

GM offers a variety of health and wellbeing benefit programs. Benefit options include medical, dental, vision, Health Savings Account, Flexible Spending Accounts, retirement savings plan, sickness and accident benefits, life insurance, paid vacation & holidays, tuition assistance programs, employee assistance program, GM vehicle discounts and more. 

Compensation:

The compensation information is a good faith estimate only. It is based on what a successful applicant might be paid in accordance with applicable state laws.  The compensation may not be representative for positions located outside of New York, Colorado, California, or Washington.
The expected base compensation for this role is: $135,000 - $209,000. Actual base compensation within the identified range will vary based on factors relevant to the position.

Este puesto se clasifica como híbrido. Esto significa que se espera que el candidato seleccionado se presente en una ubicación específica al menos 3 veces por semana {o con otra frecuencia indicada por su líder}.

El candidato seleccionado deberá viajar menos del 25 % del tiempo para este puesto.

Este puesto podría ser elegible para beneficios de relocalización.

Información sobre diversidad

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Declaración de igualdad de oportunidades en el empleo (EE.UU.)

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Adecuaciones (EE.UU. y Canadá)

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