Descripción

The Role:

GM R&D invents, evaluates, optimizes, and matures next-generation in-vehicle architectures, compute platforms, and communication systems that enable GM’s vision of the Software Defined Vehicle. We focus on how SoCs, MCUs, memory, networks, and low-level software come together into robust, safe, and cost-effective automotive platforms, spanning deeply embedded ECUs as well as high-performance compute platforms for infotainment and automated driving.

Semiconductors and compute platforms , with a focus on SoCs, MCUs, memory subsystems, and associated board-level and platform software technologies for automotive ECUs, infotainment systems, and centralized/automated driving compute platforms. You are expected to define, propose, and develop research projects in alignment with GM R&D’s strategy and priorities, and to clearly define, communicate and demonstrate the value your work creates for GM and our customers.

What You’ll Do:   

Lead semiconductor-focused research projects that influence GM’s electrical and software architecture roadmaps (central compute, zonal ECUs, domain controllers, edge nodes, infotainment, and automated driving compute platforms).
Design and implement proof-of-concept prototypes on our R&D lab benches , using evaluation platforms and representative in-vehicle architecture benches to validate concepts before transfer to product teams.
Evaluate and benchmark SoCs/MCUs and memory technologies (CPU cores, accelerators, interconnects, DDR/LPDDR, flash, NVM, cache hierarchies) for latency, throughput, power, cost, and safety/security trade-offs.
Explore and prototype new compute and communication concepts using FPGAs, evaluation boards, and custom circuitry to de-risk new architectures and features (e.g., real-time safety-critical functions, mixed‑criticality workloads).
Contribute to ECU and board-level design concepts , working with internal teams and suppliers on power, clocks, reset, high-speed interfaces (PCIe, Ethernet, DDR), and bring-up strategies.
Drive low-level software concepts around boot flows, board support packages (BSPs), bare-metal or RTOS-based implementations, device drivers, and hardware abstraction needed for SDV architectures.
Collaborate closely with GM engineering, purchasing, and suppliers to align semiconductor choices with GM’s long-term architecture, safety, cybersecurity, and cost objectives.
Seek out and aggressively pursue technology insertion opportunities at GM , working with product engineering and program teams to move successful research outcomes into production programs, pilots, or platform roadmaps.
Publish and protect IP through internal reports, patents, and external publications where appropriate, and represent GM R&D at key technical conferences and workshops.

Required Qualifications:     

Pursuit/completion of an advanced degree (Masters or PhD) degree in one of the following areas: Computer Engineering, Computer Science, Electrical Engineering, or related field

Must be graduating between August 2026 - June 2027

Able to work fulltime, 40 hours per week

Relevant research experience in semiconductors, SoC/MCU architecture, or embedded compute platforms.
Understanding of modern SoCs/MCUs, including:
- CPU cores (e.g., Arm, RISC‑V), memory hierarchies, interconnects, and on-chip peripherals.
- High-speed interfaces (e.g., PCIe, Ethernet, SerDes, DDR/LPDDR, GDDR, NVMe).·
Knowledge of automotive communication protocols (e.g., Ethernet, Time Sensitive Networking Standards, CAN, LIN, PCIe-based architectures, SOME/IP) and in-vehicle networks.
Hands-on experience in the use of oscilloscopes, logic analyzers, and JTAG for board bring-up and debug.
Experience with ECU or embedded system design and low-level software, such as:
- Board support packages, bootloaders, bare-metal or RTOS-based implementations, hardware drivers.
- Integration of low-level software with hardware in lab or bench environments.
Strong communication skills, including:
- Presenting complex technical content at multiple levels of detail (lab leadership, cross-functional partners).

Preferred Qualifications):

GM does not provide immigration-related sponsorship for this role. Do not apply for this role if you will need GM immigration sponsorship now or in the future. This includes direct company sponsorship, entry of GM as the immigration employer of record on a government form, and any work authorization requiring a written submission or other immigration support from the company (e.g., H1-B, OPT, STEM OPT, CPT, TN, J-1, etc).

The position is subject to export control restrictions and requires the successful candidate to be a U.S. Person (U.S. citizen, U.S. permanent resident, asylee or refugee).

Work Arrangement:

Hybrid: This role is categorized as hybrid. This means the successful candidate is expected to report to Warren, MI three times per week, at minimum [or other frequency dictated by the business].

To help facilitate administration of relocation benefits if you are selected, please apply using the permanent address you would move from.

Información sobre diversidad

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Declaración de igualdad de oportunidades en el empleo (EE.UU.)

General Motors se enorgullece de ser un empleador que ofrece igualdad de oportunidades. Todos los solicitantes calificados serán tenidos en cuenta para el empleo sin distinción de raza, color, religión, sexo, orientación sexual, identidad de género, nacionalidad, discapacidad o condición de veterano protegido.

Adecuaciones (EE.UU. y Canadá)

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